TEL MARK8

Equipment type: Fully automatic glue coating and development system (Coater/Developer)
Applicable wafer sizes: 200mm (8 inches) and 300mm (12 inches)
Process compatibility: i-line (365nm), KrF (248nm), ArF (193nm)
The throughput is approximately 150-200 wafers/hour (depending on the process)
Control accuracy: Uniformity of adhesive thickness ≤ ± 1nm (advanced configuration)

Technical Support

After-sales maintenance & fault resolution.

More Services

√ Equipment Dismantling & Relocation
√ Production Line Upgrades & Modernization
√ Customized Upgrade Solutions